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QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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Mini reflow oven
Pavelka, Radek ; Jelínek, Aleš (referee) ; Burian, František (advisor)
This thesis is aimed to design a small oven for PCB soldering using the reflow method. It contains description of the oven’s construction, it’s thermodynamic parameters and the design of the control and power unit PCB as well as their control software. A remote PC control and monitoring application is also a part of this thesis.
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Modification of Elektron 21 magnesium alloy microstructure via electron beam treatment
Hanáček, Josef ; Šiška, Filip (referee) ; Čížek, Jan (advisor)
This work presents a basic research on the influence of electron beam technology modification on chemical, structural and phases changes of Elektron 21 magnesium alloy. The samples were systematically modified under various parameters of the electron beam and coatings on their respective surfaces were deposited via controlled plasma electrolytic oxidation (PEO) subsequently. The influence of the EB modification on the PEO coating formation was observed. Several samples with remelted fine-grained surface layer were obtained. Having a thickness of 10^1 to 10^3 µm, the average grain sizes in this layer were quantitatively evaluated. The performed EDS analysis revealed in identical chemical composition of the remelted surface layer and the original alloy material, despite the detected sample weight loss upon the EB treatment. XRD analysis revealed an increased content of Mg3(Nd,Gd) intermetallic phase in the remelted area. The PEO coatings were more compact and less porous as compared with their counterpart coatings on the original, unmodified alloy material.The results of the presented work showed, among others, a suitable microstructure and chemical composition of some of the modified samples that could potentially exhibit enhanced corrosion resistance as opposed to the unmodified material. The corrosion testing will be part of a follow-up study. More compact PEO coatings formed on some of the modified surface layers likely represent, too, a more durable variant as compared to the original material.
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Creation of workflows and soldering profiles on the HR600 station
Shakin, Pavel ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
This bachelor's thesis deals with the issues of mounting and reflow soldering of BGA integrated circuits. For the objectives of the bachelor's thesis, the ERSA HR600 repair soldering station was used and related to this, workflows were created and profiles were optimized for placement and reflow soldering of BGA integrated circuits, and the described processes were tested on 2 types of printed circuit boards that differed in size and component density including BGA package.
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Modification of Elektron 21 magnesium alloy microstructure via electron beam treatment
Hanáček, Josef ; Šiška, Filip (referee) ; Čížek, Jan (advisor)
This work presents a basic research on the influence of electron beam technology modification on chemical, structural and phases changes of Elektron 21 magnesium alloy. The samples were systematically modified under various parameters of the electron beam and coatings on their respective surfaces were deposited via controlled plasma electrolytic oxidation (PEO) subsequently. The influence of the EB modification on the PEO coating formation was observed. Several samples with remelted fine-grained surface layer were obtained. Having a thickness of 10^1 to 10^3 µm, the average grain sizes in this layer were quantitatively evaluated. The performed EDS analysis revealed in identical chemical composition of the remelted surface layer and the original alloy material, despite the detected sample weight loss upon the EB treatment. XRD analysis revealed an increased content of Mg3(Nd,Gd) intermetallic phase in the remelted area. The PEO coatings were more compact and less porous as compared with their counterpart coatings on the original, unmodified alloy material.The results of the presented work showed, among others, a suitable microstructure and chemical composition of some of the modified samples that could potentially exhibit enhanced corrosion resistance as opposed to the unmodified material. The corrosion testing will be part of a follow-up study. More compact PEO coatings formed on some of the modified surface layers likely represent, too, a more durable variant as compared to the original material.
|
|
|
Mini reflow oven
Pavelka, Radek ; Jelínek, Aleš (referee) ; Burian, František (advisor)
This thesis is aimed to design a small oven for PCB soldering using the reflow method. It contains description of the oven’s construction, it’s thermodynamic parameters and the design of the control and power unit PCB as well as their control software. A remote PC control and monitoring application is also a part of this thesis.
|
|
|
QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
|
|
|
Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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